Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies - CentraleSupélec Access content directly
Journal Articles Procedia Engineering Year : 2010

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hal-00761224 , version 1 (05-12-2012)

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Benoît Dompierre, Véronique Aubin, Eric Charkaluk, Wilson Carlos Maia Filho, Michel Brizoux. Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies. Procedia Engineering, 2010, 2 (1), pp.1477-1486. ⟨10.1016/j.proeng.2010.03.159⟩. ⟨hal-00761224⟩
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