Journal Articles
Microelectronics Reliability
Year : 2010
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https://hal-centralesupelec.archives-ouvertes.fr/hal-00761246
Submitted on : Wednesday, December 5, 2012-10:47:48 AM
Last modification on : Monday, June 5, 2023-4:52:11 PM
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- HAL Id : hal-00761246 , version 1
- DOI : 10.1016/j.microrel.2010.07.125
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Benoît Dompierre, Wilson Carlos Maia Filho, Michel Brizoux, Véronique Aubin, Eric Charkaluk. Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy. Microelectronics Reliability, 2010, 50 (9-11), pp.1661-1665. ⟨10.1016/j.microrel.2010.07.125⟩. ⟨hal-00761246⟩
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