Influence of Thermo-mechanical Effects induced by 3D Assembly on Silicon Microring Resonator

Audrey Michard (1, 2) , Nicolas Michit (1) , Jean-Baptiste Quelene (1) , Jean-François Carpentier (1) , Pietro Maris Ferreira (2)

1 STMicroelectronics
2 GeePs - Laboratoire Génie électrique et électronique de Paris

This paper presents the impact of 3D assembly on a silicon ring resonator. Indeed, the flip-chip integration used to connect photonic and electronic circuits requires high temperatures processes. The cooling of such a structure induces thermo-mechanical stresses on silicon waveguides. A finite element modelling is proposed to theoretically quantify the stress distribution. The photo-elastic effect is then highlighted to explain the change in silicon refractive index. As a result, the ring resonance wavelength is shifted from approximately 100 pm. Performance of a WDM (wavelength division multiplexing) system could thus be highly degraded.

Domains: Engineering Sciences [physics]; Optics / Photonic; Engineering Sciences [physics]; Micro and nanotechnologies/Microelectronics

Audrey Michard, Nicolas Michit, Jean-Baptiste Quelene, Jean-François Carpentier, Pietro Maris Ferreira. Influence of Thermo-mechanical Effects induced by 3D Assembly on Silicon Microring Resonator. 19th European Conference on Integrated Optics (ECIO), Apr 2017, Eindhoven, Netherlands. ⟨hal-01535044⟩