Influence of Thermo-mechanical Effects induced by 3D Assembly on Silicon Microring Resonator

Audrey Michard; Nicolas Michit; Jean-Baptiste Quelene; Jean-François Carpentier; Pietro Maris Ferreira

Influence of Thermo-mechanical Effects induced by 3D Assembly on Silicon Microring Resonator

Audrey Michard ^{1, 2} Nicolas Michit ¹ Jean-Baptiste Quelene ¹ Jean-François Carpentier ¹ Pietro Maris Ferreira ²

2 GeePs - Laboratoire Génie électrique et électronique de Paris

Abstract : This paper presents the impact of 3D assembly on a silicon ring resonator. Indeed, the flip-chip integration used to connect photonic and electronic circuits requires high temperatures processes. The cooling of such a structure induces thermo-mechanical stresses on silicon waveguides. A finite element modelling is proposed to theoretically quantify the stress distribution. The photo-elastic effect is then highlighted to explain the change in silicon refractive index. As a result, the ring resonance wavelength is shifted from approximately 100 pm. Performance of a WDM (wavelength division multiplexing) system could thus be highly degraded.

Type de document :

Communication dans un congrès

19th European Conference on Integrated Optics (ECIO), Apr 2017, Eindhoven, Netherlands. ECIO 2017 Proceedings, 2017, 〈https://www.ecio-conference.org/〉

Domaine :

Sciences de l'ingénieur [physics] / Optique / photonique

Sciences de l'ingénieur [physics] / Micro et nanotechnologies/Microélectronique

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https://hal-centralesupelec.archives-ouvertes.fr/hal-01535044
Contributeur : Audrey Michard <>
Soumis le : jeudi 8 juin 2017 - 16:22:02
Dernière modification le : jeudi 5 avril 2018 - 12:30:24
Document(s) archivé(s) le : samedi 9 septembre 2017 - 13:25:38

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