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Influence of Thermo-mechanical Effects induced by 3D Assembly on Silicon Microring Resonator

Abstract : This paper presents the impact of 3D assembly on a silicon ring resonator. Indeed, the flip-chip integration used to connect photonic and electronic circuits requires high temperatures processes. The cooling of such a structure induces thermo-mechanical stresses on silicon waveguides. A finite element modelling is proposed to theoretically quantify the stress distribution. The photo-elastic effect is then highlighted to explain the change in silicon refractive index. As a result, the ring resonance wavelength is shifted from approximately 100 pm. Performance of a WDM (wavelength division multiplexing) system could thus be highly degraded.
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https://hal-centralesupelec.archives-ouvertes.fr/hal-01535044
Contributor : Audrey Michard <>
Submitted on : Thursday, June 8, 2017 - 4:22:02 PM
Last modification on : Wednesday, September 16, 2020 - 5:50:38 PM
Long-term archiving on: : Saturday, September 9, 2017 - 1:25:38 PM

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  • HAL Id : hal-01535044, version 1

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Audrey Michard, Nicolas Michit, Jean-Baptiste Quelene, Jean-François Carpentier, Pietro Maris Ferreira. Influence of Thermo-mechanical Effects induced by 3D Assembly on Silicon Microring Resonator. 19th European Conference on Integrated Optics (ECIO), Apr 2017, Eindhoven, Netherlands. ⟨hal-01535044⟩

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