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Conference papers
Influence of Thermo-mechanical Effects induced by 3D Assembly on Silicon Microring Resonator
Abstract : This paper presents the impact of 3D assembly on a silicon ring resonator. Indeed, the flip-chip integration used to connect photonic and electronic circuits requires high temperatures processes. The cooling of such a structure induces thermo-mechanical stresses on silicon waveguides. A finite element modelling is proposed to theoretically quantify the stress distribution. The photo-elastic effect is then highlighted to explain the change in silicon refractive index. As a result, the ring resonance wavelength is shifted from approximately 100 pm. Performance of a WDM (wavelength division multiplexing) system could thus be highly degraded.
Cited literature [2 references]
https://hal-centralesupelec.archives-ouvertes.fr/hal-01535044
Contributor : Audrey Michard Connect in order to contact the contributor
Submitted on : Thursday, June 8, 2017 - 4:22:02 PM
Last modification on : Wednesday, September 8, 2021 - 6:07:29 PM
Long-term archiving on: : Saturday, September 9, 2017 - 1:25:38 PM
Contributor : Audrey Michard Connect in order to contact the contributor
Submitted on : Thursday, June 8, 2017 - 4:22:02 PM
Last modification on : Wednesday, September 8, 2021 - 6:07:29 PM
Long-term archiving on: : Saturday, September 9, 2017 - 1:25:38 PM
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