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https://hal-centralesupelec.archives-ouvertes.fr/hal-01834171
Submitted on : Tuesday, July 10, 2018-11:50:01 AM
Last modification on : Friday, March 24, 2023-2:53:07 PM
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- HAL Id : hal-01834171 , version 1
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Shuangfeng Zhang, Eric Labouré, Denis Labrousse, Stéphane Lefebvre. Thermoelectric Cooling for Bare Dies Power Devices Embedded in PCB Substrates. PCIM, Jun 2018, Nuremberg, Germany. ⟨hal-01834171⟩
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