Thermoelectric Cooling for Bare Dies Power Devices Embedded in PCB Substrates - Archive ouverte HAL Access content directly
Conference Papers Year :
Not file

Dates and versions

hal-01834171 , version 1 (10-07-2018)

Identifiers

  • HAL Id : hal-01834171 , version 1

Cite

Shuangfeng Zhang, Eric Labouré, Denis Labrousse, Stéphane Lefebvre. Thermoelectric Cooling for Bare Dies Power Devices Embedded in PCB Substrates. PCIM, Jun 2018, Nuremberg, Germany. ⟨hal-01834171⟩
100 View
0 Download

Share

Gmail Facebook Twitter LinkedIn More