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Conference papers

Thermoelectric Cooling for Bare Dies Power Devices Embedded in PCB Substrates

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https://hal-centralesupelec.archives-ouvertes.fr/hal-01834171
Contributor : Shuangfeng Zhang <>
Submitted on : Tuesday, July 10, 2018 - 11:50:01 AM
Last modification on : Saturday, May 1, 2021 - 3:47:41 AM

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  • HAL Id : hal-01834171, version 1

Citation

Shuangfeng Zhang, Eric Labouré, Denis Labrousse, Stéphane Lefebvre. Thermoelectric Cooling for Bare Dies Power Devices Embedded in PCB Substrates. PCIM, Jun 2018, Nuremberg, Germany. ⟨hal-01834171⟩

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