https://hal-centralesupelec.archives-ouvertes.fr/hal-01845375 Contributor : Bing TieConnect in order to contact the contributor Submitted on : Friday, July 20, 2018 - 1:06:11 PM Last modification on : Thursday, April 14, 2022 - 4:50:21 PM
X. Bai, B. Tie, Denis Aubry, Jean-Hubert Schmitt. Numerical simulation of ultrasonic attenuation by a bimodal grain size polycristal. The 3rd International Workshop on Laser-Ultrasound (LUS) for Metals, Sep 2017, Stockholm, Sweden. ⟨hal-01845375⟩