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Numerical simulation of ultrasonic attenuation by a bimodal grain size polycristal

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Computer Science [cs] Modeling and Simulation Engineering Sciences [physics]

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https://hal-centralesupelec.archives-ouvertes.fr/hal-01845375

Submitted on : Friday, July 20, 2018-1:06:11 PM

Last modification on : Thursday, April 14, 2022-4:50:21 PM

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hal-01845375 , version 1 (20-07-2018)

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  • HAL Id : hal-01845375 , version 1

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X. Bai, B. Tie, Denis Aubry, Jean-Hubert Schmitt. Numerical simulation of ultrasonic attenuation by a bimodal grain size polycristal. The 3rd International Workshop on Laser-Ultrasound (LUS) for Metals, Sep 2017, Stockholm, Sweden. ⟨hal-01845375⟩

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