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Conference papers
Numerical simulation of ultrasonic attenuation by a bimodal grain size polycristal
X. Bai 1, 2
Author
B. Tie 1, 2, 3
Author IdHAL : bing-tie ORCID : https://orcid.org/0000-0002-5683-0818
Denis Aubry 1, 2
Author IdHAL : denis-aubry ORCID : https://orcid.org/0000-0003-2958-7194
Jean-Hubert Schmitt 1, 2
Author IdHAL : jean-hubert-schmitt ORCID : https://orcid.org/0000-0002-3076-2191
1
MSSMat - Laboratoire de mécanique des sols, structures et matériaux (CentraleSupélec - Bâtiment Eiffel - 3 rue Joliot Curie - 91190 GIF-SUR-YVETTE - France)
- CentraleSupélec (3, rue Joliot Curie, Plateau de Moulon, 91192 GIF-SUR-YVETTE Cedex - France)
- CNRS - Centre National de la Recherche Scientifique : UMR8579 (France)
2
CentraleSupélec (3, rue Joliot Curie,
Plateau de Moulon,
91192 GIF-SUR-YVETTE Cedex - France)
Document type :
Conference papers
Complete list of metadatas
https://hal-centralesupelec.archives-ouvertes.fr/hal-01845375
Contributor : Bing Tie <>
Submitted on : Friday, July 20, 2018 - 1:06:11 PM
Last modification on : Wednesday, July 8, 2020 - 11:10:21 AM
Contributor : Bing Tie <>
Submitted on : Friday, July 20, 2018 - 1:06:11 PM
Last modification on : Wednesday, July 8, 2020 - 11:10:21 AM
Identifiers
- HAL Id : hal-01845375, version 1
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Citation
X. Bai, B. Tie, Denis Aubry, Jean-Hubert Schmitt. Numerical simulation of ultrasonic attenuation by a bimodal grain size polycristal. The 3rd International Workshop on Laser-Ultrasound (LUS) for Metals, Sep 2017, Stockholm, Sweden. ⟨hal-01845375⟩
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