Numerical simulation of ultrasonic attenuation by a bimodal grain size polycristal

X. Bai; B. Tie; Denis Aubry; Jean-Hubert Schmitt

Conference Papers Year :

Numerical simulation of ultrasonic attenuation by a bimodal grain size polycristal

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X. Bai

Function : Author

Laboratoire de mécanique des sols, structures et matériaux

CentraleSupélec

B. Tie

Function : Author
PersonId : 20746
IdHAL : bing-tie
ORCID : 0000-0002-5683-0818
IdRef : 119419017

Laboratoire de mécanique des sols, structures et matériaux

CentraleSupélec

Centre National de la Recherche Scientifique

Denis Aubry

Function : Author
PersonId : 20763
IdHAL : denis-aubry
ORCID : 0000-0003-2958-7194
IdRef : 07688967X

Laboratoire de mécanique des sols, structures et matériaux

CentraleSupélec

Jean-Hubert Schmitt

Function : Author
PersonId : 178028
IdHAL : jean-hubert-schmitt
ORCID : 0000-0002-3076-2191
IdRef : 098791311

Laboratoire de mécanique des sols, structures et matériaux

CentraleSupélec

Domains

Modeling and Simulation Engineering Sciences [physics]

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https://hal-centralesupelec.archives-ouvertes.fr/hal-01845375

Submitted on : Friday, July 20, 2018-1:06:11 PM

Last modification on : Friday, March 24, 2023-2:53:07 PM

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hal-01845375 , version 1 (20-07-2018)

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HAL Id : hal-01845375 , version 1

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X. Bai, B. Tie, Denis Aubry, Jean-Hubert Schmitt. Numerical simulation of ultrasonic attenuation by a bimodal grain size polycristal. The 3rd International Workshop on Laser-Ultrasound (LUS) for Metals, Sep 2017, Stockholm, Sweden. ⟨hal-01845375⟩

Numerical simulation of ultrasonic attenuation by a bimodal grain size polycristal

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