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Conference papers
Numerical Modeling of Grain Size Effects on Ultrasonic Propagation in Polycrystalline Materials
X. Bai 1, 2
Author
B. Tie 1, 2, 3
Author IdHAL : bing-tie ORCID : https://orcid.org/0000-0002-5683-0818
Jean-Hubert Schmitt 1, 2
Author IdHAL : jean-hubert-schmitt ORCID : https://orcid.org/0000-0002-3076-2191
Denis Aubry 1, 2
Author IdHAL : denis-aubry ORCID : https://orcid.org/0000-0003-2958-7194
1
MSSMat - Laboratoire de mécanique des sols, structures et matériaux (CentraleSupélec - Bâtiment Eiffel - 3 rue Joliot Curie - 91190 GIF-SUR-YVETTE - France)
- CentraleSupélec (3, rue Joliot Curie, Plateau de Moulon, 91192 GIF-SUR-YVETTE Cedex - France)
- CNRS - Centre National de la Recherche Scientifique : UMR8579 (France)
2
CentraleSupélec (3, rue Joliot Curie,
Plateau de Moulon,
91192 GIF-SUR-YVETTE Cedex - France)
Document type :
Conference papers
Complete list of metadatas
https://hal-centralesupelec.archives-ouvertes.fr/hal-01845957
Contributor : Bing Tie <>
Submitted on : Friday, July 20, 2018 - 4:18:10 PM
Last modification on : Wednesday, July 8, 2020 - 11:10:21 AM
Contributor : Bing Tie <>
Submitted on : Friday, July 20, 2018 - 4:18:10 PM
Last modification on : Wednesday, July 8, 2020 - 11:10:21 AM
Identifiers
- HAL Id : hal-01845957, version 1
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Citation
X. Bai, B. Tie, Jean-Hubert Schmitt, Denis Aubry. Numerical Modeling of Grain Size Effects on Ultrasonic Propagation in Polycrystalline Materials. XIIth WCCM (World Congress on Computational Mechanics), Jul 2016, Seoul, South Korea. ⟨hal-01845957⟩
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