https://hal-centralesupelec.archives-ouvertes.fr/hal-01845957 Contributor : Bing TieConnect in order to contact the contributor Submitted on : Friday, July 20, 2018 - 4:18:10 PM Last modification on : Thursday, April 14, 2022 - 4:50:21 PM
X. Bai, B. Tie, Jean-Hubert Schmitt, Denis Aubry. Numerical Modeling of Grain Size Effects on Ultrasonic Propagation in Polycrystalline Materials. XIIth WCCM (World Congress on Computational Mechanics), Jul 2016, Seoul, South Korea. ⟨hal-01845957⟩