Multi-objective Optimization Design of Dispensing Valves in Semiconductor Packaging Systems - Archive ouverte HAL Access content directly
Conference Papers Year : 2017

Multi-objective Optimization Design of Dispensing Valves in Semiconductor Packaging Systems


As an important section in the chain of semiconductor products manufacturing, dispensing techniques and relevant dispensers drawn increasing attentions of the researchers and engineers in recent years. In some applications, the dispenser cycles are required to be completed within 2 ms and the corresponding dot diameters are usually in micrometer scale, and sometimes even in nanometer scale when extremely high precision is demanded. The factors that affect dispensing precision vary with different application cases and purpose. The designers of dispensing mechanism usually find themselves facing the difficulties to balance among these factors with the risk of losing satisfying dispensing performance. Oriented by such increasing demand of high precision and high efficiency dispensing in the electronic packaging industry, this paper presents an alternative approach for the parameter design of a dispensing valve based on the dynamic fluid simulation and multi-objective optimization. With regard to current dispensing techniques, geometric model standing for the end of nozzle and the section where air and fluid substance interact is set up. Computational fluid simulation is taken to observe the forming of droplets. The material properties and dynamic parameters are used to set up governing equations. The motion of fluid substance is modeled with Volume of Fluid model and formation and separation of droplets are simulated. With the aid of multi-objective optimization tools, the optimized solution are offered based on simulation results, which allow the designer make a reasonable tradeoff without losing the dispensing precision. © 2016 IEEE.
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hal-02426671 , version 1 (02-01-2020)



Lve Zhang, Hiroshi Yamaguchi, Frédéric Magoulès. Multi-objective Optimization Design of Dispensing Valves in Semiconductor Packaging Systems. 19th IEEE International Conference on Computational Science and Engineering, 14th IEEE International Conference on Embedded and Ubiquitous Computing and 15th International Symposium on Distributed Computing and Applications to Business, Engineering and Science, CSE-EUC-DCABES 2016, Aug 2016, Paris, France. pp.604-613, ⟨10.1109/CSE-EUC-DCABES.2016.248⟩. ⟨hal-02426671⟩
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